Topic: Surface moisture affecting operational amplifier output drift on a FR-4 multi-layer PCB. (board layup) - 1). component layer, 2). ground plane, 3). power plane, 4). solder side layer Question: When shielding the input pins of an operational amplifier with guard rings, is it recommended to expose the guard traces (solder over tin reflow), rather than covering them with solder mask ? *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text. * ***************************************************************************