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February 2000

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TechNet <[log in to unmask]>
Subject:
PCB Pad Size For BGA device
From:
Michael Forrester <[log in to unmask]>
Date:
Wed, 9 Feb 2000 16:18:31 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Michael Forrester <[log in to unmask]>
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I have a questions about the pad size needed for a BGA device. We are using a 25
mil 10/90 balls on an organic substrate (FR4).
 We currently have 20 mil, non-solder mask defined, pads on both the device and
PCB.  What is the recommended  pad size?  We
have control over the pad size on the device and PCB.  Thank you.

Best Regards,

Mike Forrester

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