I have a questions about the pad size needed for a BGA device. We are using a 25
mil 10/90 balls on an organic substrate (FR4).
 We currently have 20 mil, non-solder mask defined, pads on both the device and
PCB.  What is the recommended  pad size?  We
have control over the pad size on the device and PCB.  Thank you.

Best Regards,

Mike Forrester

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