Hello Technetters,

      It is a trouble before half of year.

      Our boards cannot pass the electrical ICT test , and the problem is located on BGA or the solder joint,  and the vender of BGA component donnot agree the failure is his matter, and our compony process is always reliable, and assembly other or more complex board with BGA, the fail rate is much low than it.

      We cannot low the failure rate although under very controlled process(PCB design, manufacture, printing, placement, reflow....). 

      Now only way is to replace BGA  with new one, then test , rework, again and again  until it works. But this BGA component is very expensive.

      Our company have the X-ray machine(which can inspect bridge,Void, but cannot find out the open fail in the SJ).

      Can you show me the good way  to locate that which is main failure cause between BGA component and SJ? and the analysis method?



Thanks for your any input.



Best Regards,



Liu Changkang