Dear Engelmaier,
Nice meeting your too.
Actually, the same problem had happened in our factory, the failure can locate in PBGA&SJ, After much efforts on SJ doubt, the problem still existed, and the BGA failure analysis showed much problem in it's process, then vender began to accept it was his problem, and now the problem was solved.
But this kind problem comes out again in another board, this time we cannot locate problem in single BGA and SJ under BGA. Because the components is a system to function which many component including PBGA, chip, QFP..., we cannot test the function between components through ICT or other method. So we only know the system is failure, including series of components, SJ, PCB(HDI). and the board is very expensive. only way I can do is exclude one by one through destructive analysis, but still cannot locate the failure.
The PWB is our company first HDI board(1+N).our X-ray machine is HP 5DX. and through
component analysis we cannot find obvious failure.now we concern about PWB quality.
By the way, when reflowing PBGA, the SJ height will short under the function of BGA gravity, now we had one TBGA which is much more weight than comman PBGA, and which ball material still is Sn63/Pb37. I am worry about the reliablity of SJ. So can you tell me which height is safety to SJ in the communication product?
Thanks for your input.
Best Regards,
Liu Changkang
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, February 09, 2001 1:08 AM
Subject: Re: [TN] Locate the failure of component & SJ
> Dear Liu,
> It was nice meeting you at APEX. I am sorry to hear, that you still have
> problems with soldering of BGAs. You do not say what type/size of BGAs are
> involved, what kind of metallization is on the BGA/PCB, and what kind of
> X-ray machine with what kind of capabilities you have. Also you do not say
> whether you did a failure mode analysis, and what you found.
> No determination of what needs to be done can be made until you know what is
> wrong and what is causing it.
>
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL 32174 USA
> Phone: 904-437-8747, Fax: 904-437-8737
> E-mail: [log in to unmask], Website: www.engelmaier.com
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