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Date: | Thu, 25 Feb 2010 12:42:34 -0500 |
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I think you are going to need to try it. The holes will change the way the
material moves. There are a lot of variables that would change the
performance of the underfill.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Temkin, Gregg
Sent: Thursday, February 25, 2010 12:22 PM
To: [log in to unmask]
Subject: [TN] Are open vias in underfill area a problem?
Are there any concerns with .008" dia vias beneath a BGA requiring
underfill? Would these holes be sufficiently small to prevent "leakage" to
the other side of the PWB? The underfill material used will be Loctite
3563. I don't care if the vias fill, just don't want material draining out
the other side.
Thanks,
Gregg
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