I think you are going to need to try it. The holes will change the way the
material moves. There are a lot of variables that would change the
performance of the underfill. 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Temkin, Gregg
Sent: Thursday, February 25, 2010 12:22 PM
To: [log in to unmask]
Subject: [TN] Are open vias in underfill area a problem?

Are there any concerns with .008" dia vias beneath a BGA requiring
underfill?  Would these holes be sufficiently small to prevent "leakage" to
the other side of the PWB?  The underfill material used will be Loctite
3563.  I don't care if the vias fill, just don't want material draining out
the other side.

Thanks,

Gregg

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