Dear Technetters,

In IPC-2221 "Generic Standard on Printed Board Design" the following is
said about blind vias "Blind via holes should be filled or plugged with
a polymer or solder resist to prevent solder from entering them as
solder in the small holes decreases reliability".

This is the first time I hear about the reliability of the blind via's
going down with the introduction of solder in the hole. Does anyone have

more information about this decrease in reliability? (i.e. know of
testing done in this area, or have witnessed something to that effect)
Would connecting BGA's to blind vias constitute filling the hole, hence
reducing its reliability?

Thanks,

Remi Charron