Dear Technetters, In IPC-2221 "Generic Standard on Printed Board Design" the following is said about blind vias "Blind via holes should be filled or plugged with a polymer or solder resist to prevent solder from entering them as solder in the small holes decreases reliability". This is the first time I hear about the reliability of the blind via's going down with the introduction of solder in the hole. Does anyone have more information about this decrease in reliability? (i.e. know of testing done in this area, or have witnessed something to that effect) Would connecting BGA's to blind vias constitute filling the hole, hence reducing its reliability? Thanks, Remi Charron