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June 2002

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Subject:
From:
Brian McCrory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 Jun 2002 12:38:36 -0700
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Steve Kelly wrote:

> Does anyone know which IPC covers layer-to layer registration
> requirements on multi-layer flex circuits. The only thing I can
> find is something in MIL-P-50884 which is moribund as well as
> out of date with today’s processes. Thanks. Steve Kelly
>
Steve,

I think you want IPC-6013 with Amendment 1, "Qualification and
Performance Specification for Flexible Printed Boards".

--
Brian


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