Steve Kelly wrote: > Does anyone know which IPC covers layer-to layer registration > requirements on multi-layer flex circuits. The only thing I can > find is something in MIL-P-50884 which is moribund as well as > out of date with today’s processes. Thanks. Steve Kelly > Steve, I think you want IPC-6013 with Amendment 1, "Qualification and Performance Specification for Flexible Printed Boards". -- Brian