Steve Kelly wrote:

> Does anyone know which IPC covers layer-to layer registration
> requirements on multi-layer flex circuits. The only thing I can
> find is something in MIL-P-50884 which is moribund as well as
> out of date with today’s processes. Thanks. Steve Kelly
>
Steve,

I think you want IPC-6013 with Amendment 1, "Qualification and
Performance Specification for Flexible Printed Boards".

--
Brian