TECHNET Archives

July 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet <[log in to unmask]>
X-To:
Barbara Burcham <[log in to unmask]>
Date:
Wed, 7 Jul 1999 00:21:22 +1000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, ed hale <[log in to unmask]>
Subject:
Re: Solder Paste Standards
From:
ed hale <[log in to unmask]>
In-Reply-To:
<[log in to unmask]>
Content-Type:
text/plain; charset="us-ascii" ; format="flowed"
Parts/Attachments:
text/plain (17 lines) 
Barbara,
        Suggest you look at some of the sessions for SMTA
International Conference. From what I read there  will be quite a lot
of discussion on and around this subject. Lokat their site
www.smta.org

Regards

Edward Hale


>Who knows what the Standards are for artwork for Solder Paste. Should
>gerbers match pad size, be over, be under.
>Could not find info in the IPC Specs I have.
>
>Barbara Burcham

ATOM RSS1 RSS2