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July 1999

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Sender:
TechNet <[log in to unmask]>
Subject:
Re: Solder Paste Standards
From:
KELLY M SCHRIVER <[log in to unmask]>
Date:
Fri, 9 Jul 1999 09:18:00 -0400
X-To:
Barbara Burcham <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, KELLY M SCHRIVER <[log in to unmask]>
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text/plain (9 lines) 
Barbara -

Generally, the CAD file for a solder paste artwork is scaled to match the pad
sizes or 5% under.  It is a tool which can be adjusted by the manufacturing
engineering function at whatever assembly facility deals with the product.  In
this manner, the product remains adjustable to fit the assemblers processes.

Regards - Kelly

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