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47:47 1997 |
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--- On Fri, 7 Feb 97 12:11:42 PST [log in to unmask] wrote:
Dear collegues ,
I am looking for
Designrules for Laouting of PCB's for BGA (Ballgrid Array)-Assembly
especially Requirements of Solder masks.
Who can help me find some documents about this matter (IEC-Standards, IPC-Standards )?
Is there a working group in preparing these standards ?
I am very interested in answers.
M. Jeremias
Daimler Benz Aerospace
Sensorsystems
Advanced technologies
-----------------End of Original Message-----------------
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