--- On Fri, 7 Feb 97 12:11:42 PST [log in to unmask] wrote: Dear collegues , I am looking for Designrules for Laouting of PCB's for BGA (Ballgrid Array)-Assembly especially Requirements of Solder masks. Who can help me find some documents about this matter (IEC-Standards, IPC-Standards )? Is there a working group in preparing these standards ? I am very interested in answers. M. Jeremias Daimler Benz Aerospace Sensorsystems Advanced technologies -----------------End of Original Message----------------- *************************************************************************** * The mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To unsubscribe from this list at any time, send a message to: * * [log in to unmask] with <subject: unsubscribe> and no text.* *************************************************************************** * If you are having a problem with the DesignerCouncil, please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************