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Date: | Thu, 11 Nov 2010 10:19:07 +0530 |
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Hi Scott,
I have used the following parameters in few of my designs,
If NSMD Copper Pad - 200um, Soldermask opening - 300um
If SMD Copper Pad - 300um, Soldermask opening - 200um
Assembly/FAB house will suggest on SMD/NSMD based on their process
control....
Via on pad for escape routing......(Offset via can create non circular PAD
Which can impact assembly yield)
Via and Drill of 200um/100um
Stacked MicroVia From L1-L2 and L2-L3
L2 is designated as GND plane with Minimum/Zero escape routing....
It's always better to consult with your Fab/Assembly house in the earlier
stage of design. Especially when you have POP package
Regards,
RaGZ.
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