Hi Scott, I have used the following parameters in few of my designs, If NSMD Copper Pad - 200um, Soldermask opening - 300um If SMD Copper Pad - 300um, Soldermask opening - 200um Assembly/FAB house will suggest on SMD/NSMD based on their process control.... Via on pad for escape routing......(Offset via can create non circular PAD Which can impact assembly yield) Via and Drill of 200um/100um Stacked MicroVia From L1-L2 and L2-L3 L2 is designated as GND plane with Minimum/Zero escape routing.... It's always better to consult with your Fab/Assembly house in the earlier stage of design. Especially when you have POP package Regards, RaGZ. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------