Hi Michael
It would help to know what "problem" you are having.
Recently I have been dealing with companies who certify to IPC-6012 Class 2
or 3
and do not perform required thermal stress microsections on each lot of
boards.  So I am beginning my campaign to try and improve those occurences.
So I would be interested to know if you are have plated through hole type
problems.

6012 has requirements for cleanliness prior to solder mask application,  It
does not
have cleanliness requirements for boards after Hot Air Leveling or with other
surface
finishes.  This becomes relevant with low residue flux soldering operations
and you and your board shop need to establish values for bare board
cleanliness based on each of you doing the same test.  The variability of
results from various cleanliness testers, makes this a true joint effort.

Please let us know what the problems were.

Susan Mansilla
Technical Director
Robisan Lab

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