Hi Michael It would help to know what "problem" you are having. Recently I have been dealing with companies who certify to IPC-6012 Class 2 or 3 and do not perform required thermal stress microsections on each lot of boards. So I am beginning my campaign to try and improve those occurences. So I would be interested to know if you are have plated through hole type problems. 6012 has requirements for cleanliness prior to solder mask application, It does not have cleanliness requirements for boards after Hot Air Leveling or with other surface finishes. This becomes relevant with low residue flux soldering operations and you and your board shop need to establish values for bare board cleanliness based on each of you doing the same test. The variability of results from various cleanliness testers, makes this a true joint effort. Please let us know what the problems were. Susan Mansilla Technical Director Robisan Lab ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################