TECHNET Archives

August 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Subject:
BGA and uBGA Solder paste
From:
"Valladares, Hector A (FL51)" <[log in to unmask]>
Date:
Wed, 18 Aug 1999 10:17:47 -0400
Content-Type:
text/plain; charset="iso-8859-1"
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Valladares, Hector A (FL51)" <[log in to unmask]>
Parts/Attachments:
text/plain (26 lines) 
I would like to find out what kind of solder pastes are BGA  and uBGA users
using that are having to coat PWA with polyurethane type coating.
All comments are welcome.
Thanks in advance.

Hector Valladares
Honeywell -SASSO
Production Staff Engineer
727.539.3683 voice
727.539.4469 Fax
[log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2