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November 2006

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Subject:
Manufacturing with Electroplated Gold PCB in LF applications
From:
Rajesh Dhoum <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rajesh Dhoum <[log in to unmask]>
Date:
Fri, 3 Nov 2006 12:56:35 -0500
Content-Type:
text/plain
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text/plain (49 lines) 
Has anyone experienced problems related to cracked BGA balls (board
side) applied to electroplated gold (150 micro inches of electrolytic
nickel under 5 - 15 microinches of gold) PCBs using a lead free process?
The cracking is believed to occur during the cool down of the board
after the solder joint has solidified.  The fallout has been minimized
by adjusting the thermal profile through the SMT oven.  Are there any
concerns with the manufacturing process of electroplated gold PCBs that
might affect the solder joint strength?

 

Regards

Rajesh

 


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