TECHNET Archives

March 2010

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
TechNet E-Mail Forum <[log in to unmask]>
Date:
Wed, 10 Mar 2010 17:14:12 -0500
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Subject:
From:
Lee Whiteman <[log in to unmask]>
Content-Transfer-Encoding:
base64
In-Reply-To:
Content-Type:
text/plain; charset="utf-8"
MIME-Version:
1.0
Parts/Attachments:
text/plain (1 lines)
If you had to re-ball a BGA with 90Pb/10Sn non-collapsible solder balls, what would your peak temperature be? For reflow soldering processing purposes, what would your peak temperature be?

If it was eutectic SnPb, I would anticipate the peak temperature to be about 215C for re-balling and reflow soldering.

Lee Whiteman, PMP
Senior Member Engineering Staff
L-3 Communications East
Telephone: (856) 338-3508
FAX: (856) 338-2906
E-Mail: [log in to unmask]


______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2