Joe, there are many factors which effect (affect?? I can never get
     that right) the amount of copper plated on the surface of a panel.
     Surface area, plating distribution, hole sizes and minimum copper
     thickness in the hole are some of the major factors.
        If the customer wants 1.0 mil minimum copper in the hole, we will
     shoot for an average thickness of 1.3 mils, which may yield 1.6 to 2.0
     mils on the surface (average).  So your maximum thickness, in this
     case, would be between 2.2 to 2.6 mils (some of the surface copper is
     removed before plating, so the starting thickness is .5 to .6 mils).

     Hope this helps.

     John Anselmo
     Hadco - Tech Center Austin


______________________________ Reply Separator _________________________________
Subject: [TN] Thickness after plating
Author:  "Hurst; Joe" <[log in to unmask]> at smtplink-hadco
Date:    2/8/00 12:39 PM


Folks


        For an outside layer,  we generally specify 0.5 oz copper with 0.001
inch of copper plating on all conductive surfaces.

        IPC-6012, Table 3-9 lists the minimum thickness after plating as
.0013 inch.

        Can anyone please tell me what the maximum thickness, after plating,
might be ;  and what affects this ?


Joe Hurst, CET
PWB Designer
Computing Devices Canada
A General Dynamics Company
[log in to unmask]
613-596-7816

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