Joe, there are many factors which effect (affect?? I can never get that right) the amount of copper plated on the surface of a panel. Surface area, plating distribution, hole sizes and minimum copper thickness in the hole are some of the major factors. If the customer wants 1.0 mil minimum copper in the hole, we will shoot for an average thickness of 1.3 mils, which may yield 1.6 to 2.0 mils on the surface (average). So your maximum thickness, in this case, would be between 2.2 to 2.6 mils (some of the surface copper is removed before plating, so the starting thickness is .5 to .6 mils). Hope this helps. John Anselmo Hadco - Tech Center Austin ______________________________ Reply Separator _________________________________ Subject: [TN] Thickness after plating Author: "Hurst; Joe" <[log in to unmask]> at smtplink-hadco Date: 2/8/00 12:39 PM Folks For an outside layer, we generally specify 0.5 oz copper with 0.001 inch of copper plating on all conductive surfaces. IPC-6012, Table 3-9 lists the minimum thickness after plating as .0013 inch. Can anyone please tell me what the maximum thickness, after plating, might be ; and what affects this ? Joe Hurst, CET PWB Designer Computing Devices Canada A General Dynamics Company [log in to unmask] 613-596-7816 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################