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Joe, there are many factors which effect (affect?? I can never get
that right) the amount of copper plated on the surface of a panel.
Surface area, plating distribution, hole sizes and minimum copper
thickness in the hole are some of the major factors.
If the customer wants 1.0 mil minimum copper in the hole, we will
shoot for an average thickness of 1.3 mils, which may yield 1.6 to 2.0
mils on the surface (average). So your maximum thickness, in this
case, would be between 2.2 to 2.6 mils (some of the surface copper is
removed before plating, so the starting thickness is .5 to .6 mils).
Hope this helps.
John Anselmo
Hadco - Tech Center Austin
______________________________ Reply Separator _________________________________
Subject: [TN] Thickness after plating
Author: "Hurst; Joe" <[log in to unmask]> at smtplink-hadco
Date: 2/8/00 12:39 PM
Folks
For an outside layer, we generally specify 0.5 oz copper with 0.001
inch of copper plating on all conductive surfaces.
IPC-6012, Table 3-9 lists the minimum thickness after plating as
.0013 inch.
Can anyone please tell me what the maximum thickness, after plating,
might be ; and what affects this ?
Joe Hurst, CET
PWB Designer
Computing Devices Canada
A General Dynamics Company
[log in to unmask]
613-596-7816
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