Copper/Aluminium clad Teflon Plating

Specifically, my query concerns plating 0.5oz to 1oz copper on Teflon
with 1/8 to 1/4 Aluminium back (6061).

What is the best method of activating the Aluminium surface prior to
plating without using a nitric desmut, as this attacks the copper
surface.
or
What can be used for removing the smut on the Aluminium surface after
etching in a potassium fluoride etch which will not attack the copper
surface.

How can I achieve maximum adhesion of electroless nickel on Aluminium,
such as double dipping in Zincate. without stripping the Zincate with
Nitric

Thanks in advance

Graham Savage
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