Copper/Aluminium clad Teflon Plating Specifically, my query concerns plating 0.5oz to 1oz copper on Teflon with 1/8 to 1/4 Aluminium back (6061). What is the best method of activating the Aluminium surface prior to plating without using a nitric desmut, as this attacks the copper surface. or What can be used for removing the smut on the Aluminium surface after etching in a potassium fluoride etch which will not attack the copper surface. How can I achieve maximum adhesion of electroless nickel on Aluminium, such as double dipping in Zincate. without stripping the Zincate with Nitric Thanks in advance Graham Savage [log in to unmask] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################