TECHNET Archives

November 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Mon, 17 Nov 1997 11:50:32 -0800
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, [log in to unmask]
Subject:
Re: frequency of solder pot content analysis
From:
[log in to unmask]
Content-Transfer-Encoding:
7bit
In-Reply-To:
<[log in to unmask]>
Content-Type:
text/plain; charset=US-ASCII; name="Re:"
MIME-Version:
1.0
Parts/Attachments:
Re: (13 lines) 
My concern for solder pot analysis would be for boards of 100% flash gold run
through a wave solder machine in high volume. I am concerned about gold content
in the solderpot. My question is would this change the frequency of checking the
solderpot and what equipment would one use. Would this be sent to an outside lab
or equipment we would expect our contract manufacturers to have in house?

Steve O'Hara
[log in to unmask] Reply Separator
_________________________________
Subject: Re: [TN] frequency of solder pot content analysis
Author:  Non-HP-eng ([log in to unmask]) at HP-Vancouver,mimegw10

ATOM RSS1 RSS2