TECHNET Archives

September 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 Sep 2001 13:25:39 -0400
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (323 bytes) , text/html (1131 bytes)
Anyone out there with data, case study, anecdotal evidence, strong opinions,
relative to installation of PBGA components (with eutectic solder balls of
course) using micro stencil and solder paste verses tacky flux.

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290




ATOM RSS1 RSS2