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September 2001

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From:
Guy Ramsey <[log in to unmask]>
Date:
Fri, 7 Sep 2001 13:25:39 -0400
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Anyone out there with data, case study, anecdotal evidence, strong opinions,
relative to installation of PBGA components (with eutectic solder balls of
course) using micro stencil and solder paste verses tacky flux.

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290




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