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Subject:	Re: SOLDER BEAD SURVEY
From:	Howard Watson <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 27 Sep 2001 10:58:25 -0400
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James,

We do not inspect for solder beads under chip components, and from a
random inspection, I have not seen any.  However, until recently, we have
had a horrendous problem with squeeze out beads, which because of our
no-clean process, have to be picked off one at a time.  I estimate
500,000, give or take 100,000 or so, solder beads per month have been
removed from our boards.

I stated "until recently" we had solder beads, because after changing
solder paste a month ago, the solder beads have virtually gone away, much
to the delight of the operators.  Other process changes like homeplate
aperture design, reduced stencil thickness, and improved reflow profile
have helped a lot, but the new paste put a closure on this issue.  Good
luck!

Howard Watson
Manufacturing Engineer
AMETEK/Dixson




"Marsico, James" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
09/26/01 01:44 PM
Please respond to "TechNet E-Mail Forum."


        To:     [log in to unmask]
        cc:
        Subject:        [TN] SOLDER BEAD SURVEY


Ok... Here we go again.  We are experiencing solder beads found UNDER chip
components.  The following questions are for all SMT assemblers (this info
would be very helpful to me):

1)      Do you look for solder balls under chip devices?
2)      Do you find them?
3)      Do you rework this anomaly?
4)      What workmanship criteria are you working to (i.e. MIL-STD-2000,
IPC-610, other)?

Thanks in advance,
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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