Hi Technetters,
Do you know the opening style (aperture) for stencil (metal mask) applied
for printing solder paste on resistance, capacitor chip 0603mmm to prevent
"Tombstone/Manhattan" after reflow. Also, pls. advise about stencil
thickness.
Last but not least, is the reflow profile important for this defect? Any
suggestion?
Thanks in advance,
Le Ai Quoc
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