Hi, Everybody,
 
At this moment, we have used the dry film lamination and electro-deposition

photo resist to make the lead frames and PWB inner layers. 

 As the liquid photo-resists is more and more popular to be used for

the PCB inner layers to replace the dry-film lamination.

Would anybody know the  key points of the roller coaters

and how to keep the good yields of this methods.

Thanks 

Chung J. Lee / Hsin-Sun