Hi, Everybody, At this moment, we have used the dry film lamination and electro-deposition photo resist to make the lead frames and PWB inner layers. As the liquid photo-resists is more and more popular to be used for the PCB inner layers to replace the dry-film lamination. Would anybody know the key points of the roller coaters and how to keep the good yields of this methods. Thanks Chung J. Lee / Hsin-Sun