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Date: | Tue, 30 May 2006 17:43:40 -0400 |
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John, et. al.
Thanks for the various suggestions. We have had some experience with "3D
XRay"
systems in the past and will try it out on our solder ball joints. I will
share the results
with the net if we learn anything noteworthy.
Andy
John Burke <[log in to unmask]> on 05/30/2006 12:59:56 PM
Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to
John Burke <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Andrew Shieh/CSP)
Subject: Re: [TN] solder ball analysis
I used that type of system and it will definitely find the issues,
particulary useful on a co-planar defect at the boards interface.
I used this system 2 years ago up north of San Francisco I think, it cost
about $4000 for the set up plus about the same for the shots, but the
results were incredible, you can literally "fly" through the 3D Xray using
the software.
If needed I wil dig up th company and details of the people and send off
line.
John
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, May 30, 2006 8:29 AM
To: [log in to unmask]
Subject: Re: [TN] solder ball analysis
When you are looking at the balls on the BGA for this analysis, what
features are you looking to find? Crack? Opens? Unsoldered balls? I know
that
Micro-CT imaging can get down to sub-micron feature sizes in 3-D. Does
that get
you the detail you need?
Jon Moore
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