John, et. al. Thanks for the various suggestions. We have had some experience with "3D XRay" systems in the past and will try it out on our solder ball joints. I will share the results with the net if we learn anything noteworthy. Andy John Burke <[log in to unmask]> on 05/30/2006 12:59:56 PM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to John Burke <[log in to unmask]> To: [log in to unmask] cc: (bcc: Andrew Shieh/CSP) Subject: Re: [TN] solder ball analysis I used that type of system and it will definitely find the issues, particulary useful on a co-planar defect at the boards interface. I used this system 2 years ago up north of San Francisco I think, it cost about $4000 for the set up plus about the same for the shots, but the results were incredible, you can literally "fly" through the 3D Xray using the software. If needed I wil dig up th company and details of the people and send off line. John -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask] Sent: Tuesday, May 30, 2006 8:29 AM To: [log in to unmask] Subject: Re: [TN] solder ball analysis When you are looking at the balls on the BGA for this analysis, what features are you looking to find? Crack? Opens? Unsoldered balls? I know that Micro-CT imaging can get down to sub-micron feature sizes in 3-D. Does that get you the detail you need? Jon Moore --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------