Sender: |
|
X-To: |
|
Date: |
Thu, 16 Aug 2012 06:33:38 -0700 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Message-ID: |
|
Content-Transfer-Encoding: |
quoted-printable |
Content-Type: |
text/plain; charset="us-ascii" |
From: |
|
Parts/Attachments: |
|
|
Dear Technetters,
We are going to be assembling some lead-free 1.6x0.8 mm micro BGAs with
0.5mm pitch and 0.17mm dia board pads. Anybody else have experience with
this small a package?....I am concerned that there won't be sufficient
flux in the tiny solder deposit to clean the oxides during reflow,
leading to graping and/or head in pillow situation. Do I need a dip
fluxer for the part to do a flux only attachment, or to augment the
amount of flux in the solderpaste-solder bump system? I am told I have
no time to do DOEs to determine stencil and reflow parameters, so I am
turning to technet for help.....any thoughts?
Regards,
Amol
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|