Dear Technetters, We are going to be assembling some lead-free 1.6x0.8 mm micro BGAs with 0.5mm pitch and 0.17mm dia board pads. Anybody else have experience with this small a package?....I am concerned that there won't be sufficient flux in the tiny solder deposit to clean the oxides during reflow, leading to graping and/or head in pillow situation. Do I need a dip fluxer for the part to do a flux only attachment, or to augment the amount of flux in the solderpaste-solder bump system? I am told I have no time to do DOEs to determine stencil and reflow parameters, so I am turning to technet for help.....any thoughts? Regards, Amol ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________