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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 24 Sep 1998 07:43:08 -0500 |
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I suppose you could look at it from a cost stand point. If the customer is
willing to pay for the cost of the pallet, go for it. Otherwise, for 15
boards I wouldn't spend the extra on a solder pallet or the solder stencil
for the bottom side. Your original process method is still very valid. A
good ICT test should have picked up on the short failure.
Thomas C Han <[log in to unmask]> on 09/22/98 08:09:10 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to Thomas C Han <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Andrew G Kettlewell/PGG/Cummins)
Subject: [TN] Wave solder VS Reflow on bottom side
Hi all
I have a mixed technology double sided board. It has about 900
components w/ 250 passive components on bottom. The total project is for
only 15 boards and 2 boards were manufactured for first article test.
Since the total account was for such small quantity I ran all 15 boards
thru SMT. The process was: top side reflow, bottom side epoxy, PTH
insertion, wave. Problem is that our customer found 1 solder short
across a cap on the bottom side, and so he is questioning my process of
epoxying the bottom side. Even though he is a manufacturing engineer, he
is not knowledgable in PCB assembly processes. How can I explane to him
that any failure in a component is wrong, but 1 out of 500 components( 2X
250 on bottom) is an acceptable figure that I do not see a need for
change. He insists that since his past CM used reflow and then a pallet
thru wave, that that is a superior process.
He also questioned the fact that solder short on that particular location
happened only to 1 board. And that if I took a systematic process, then
the solder short should exist on both boards.
Fellow Technetters, tell me how I can deal with such complaints.
Thanks for all your input.
Tom Han
Ardent Systems
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