I suppose you could look at it from a cost stand point. If the customer is willing to pay for the cost of the pallet, go for it. Otherwise, for 15 boards I wouldn't spend the extra on a solder pallet or the solder stencil for the bottom side. Your original process method is still very valid. A good ICT test should have picked up on the short failure. Thomas C Han <[log in to unmask]> on 09/22/98 08:09:10 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to Thomas C Han <[log in to unmask]> To: [log in to unmask] cc: (bcc: Andrew G Kettlewell/PGG/Cummins) Subject: [TN] Wave solder VS Reflow on bottom side Hi all I have a mixed technology double sided board. It has about 900 components w/ 250 passive components on bottom. The total project is for only 15 boards and 2 boards were manufactured for first article test. Since the total account was for such small quantity I ran all 15 boards thru SMT. The process was: top side reflow, bottom side epoxy, PTH insertion, wave. Problem is that our customer found 1 solder short across a cap on the bottom side, and so he is questioning my process of epoxying the bottom side. Even though he is a manufacturing engineer, he is not knowledgable in PCB assembly processes. How can I explane to him that any failure in a component is wrong, but 1 out of 500 components( 2X 250 on bottom) is an acceptable figure that I do not see a need for change. He insists that since his past CM used reflow and then a pallet thru wave, that that is a superior process. He also questioned the fact that solder short on that particular location happened only to 1 board. And that if I took a systematic process, then the solder short should exist on both boards. Fellow Technetters, tell me how I can deal with such complaints. Thanks for all your input. Tom Han Ardent Systems _____________________________________________________________________ You don't need to buy Internet access to use free Internet e-mail. Get completely free e-mail from Juno at http://www.juno.com Or call Juno at (800) 654-JUNO [654-5866] ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################ ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################