Hey Y'all,

 

It is my habit to teardrop a trace coming into a through-hole pad if the
trace is 5 mils or less and the annular ring of the pad is 5 mils or
less.

Does this improve manufacturability of the bare board, protect against
drill-out, and fracturing of the point where the trace enters the pad
under shock and vibration?

Or am I an old-fashioned girl?

 

 

Barbara Burcham, C.I.D.

Sr. PCB Designer

RFTrax a Fairfield Co.

[log in to unmask]

281-276-5916

281-276-5950 fax

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------