Hey Y'all, It is my habit to teardrop a trace coming into a through-hole pad if the trace is 5 mils or less and the annular ring of the pad is 5 mils or less. Does this improve manufacturability of the bare board, protect against drill-out, and fracturing of the point where the trace enters the pad under shock and vibration? Or am I an old-fashioned girl? Barbara Burcham, C.I.D. Sr. PCB Designer RFTrax a Fairfield Co. [log in to unmask] 281-276-5916 281-276-5950 fax --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------