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Date: | Wed, 23 Apr 1997 13:49:33 -0700 |
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Hello to All,
A colleague here has the following questions:
1. We'd like to know how much of a long-term reliability impact to expect
from
going from a 2-heat-cycle process (like double-sided reflow) to a
3-heat-cycle
process (double-sided reflow plus wave solder).
We're talking about doing this on a product with a lifetime warranty.
I am looking for any kind of data, case studies, or anecdotal evidence. So
far,
all we know is that "more heat cycles is bad", because of thermal stress to
the
board (causing inner-layer opens which can be intermittent) and to the
components. But we'd like to get some idea of HOW bad, and what the
agreed-upon
limit is as to number of heat cycles.
2. I'm also interested in finding anyone who is using the "Micropoint Single
Point Soldering" machine, manufactured by Pillarhouse International. What
kind
of volumes are they running, on what kind of product, and how do they like
it?
Thanks in Advance,
Jerry Hall
PCA Operations, Fluke Electronics
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