Hello to All,

A colleague here has the following questions:


1. We'd like to know how much of a long-term reliability impact to expect 
from 
going from a 2-heat-cycle process (like double-sided reflow) to a 
3-heat-cycle 
process (double-sided reflow plus wave solder). 

We're talking about doing this on a product with a lifetime warranty.

I am looking for any kind of data, case studies, or anecdotal evidence. So 
far, 
all we know is that "more heat cycles is bad", because of thermal stress to 
the 
board (causing inner-layer opens which can be intermittent) and to the 
components. But we'd like to get some idea of HOW bad, and what the 
agreed-upon 
limit is as to number of heat cycles.

2. I'm also interested in finding anyone who is using the "Micropoint Single 
Point Soldering" machine, manufactured by Pillarhouse International. What 
kind 
of volumes are they running, on what kind of product, and how do they like 
it?

Thanks in Advance,

Jerry Hall
PCA Operations, Fluke Electronics
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