Hello to All, A colleague here has the following questions: 1. We'd like to know how much of a long-term reliability impact to expect from going from a 2-heat-cycle process (like double-sided reflow) to a 3-heat-cycle process (double-sided reflow plus wave solder). We're talking about doing this on a product with a lifetime warranty. I am looking for any kind of data, case studies, or anecdotal evidence. So far, all we know is that "more heat cycles is bad", because of thermal stress to the board (causing inner-layer opens which can be intermittent) and to the components. But we'd like to get some idea of HOW bad, and what the agreed-upon limit is as to number of heat cycles. 2. I'm also interested in finding anyone who is using the "Micropoint Single Point Soldering" machine, manufactured by Pillarhouse International. What kind of volumes are they running, on what kind of product, and how do they like it? Thanks in Advance, Jerry Hall PCA Operations, Fluke Electronics [log in to unmask] *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************