Used to purchase fusing oil with a Chevron label. They had a water soluble
as well as solvent oil but seems to me that the WS was at a significantly
higher price. Hollis used to carry oil for their oil injection wave
machines which was basically the same thing. Think it was Hollis 225. Did
a very nice job of wave soldering and reducing dross on the pot but sure was
messy.
Mel Parrish
Soldering Technology International
Madison, AL
256 705 5530
256 705 5538 Fax
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill
Sent: Monday, November 19, 2001 8:48 AM
To: [log in to unmask]
Subject: Re: [TN] AW: [TN] BGA voids
We used to make PCB's back in the mid 1970's and used a fusing oil
produced by Shell Oil in our Hydro-squeegee. I want to say it was some sort
of Peanut oil... but I can't remember for sure... Those were my High School
years... :)
Good luck... - Bill Brooks
-----Original Message-----
From: David Fish [mailto:[log in to unmask]]
Sent: Monday, November 19, 2001 11:27 AM
To: [log in to unmask]
Subject: Re: [TN] AW: [TN] BGA voids
Who are suppliers of inspection quality oils [Canadian Balson??] the
bear the heat of soldering well?
----- Original Message -----
From: Bob Willis
To: [log in to unmask]
Sent: Monday, November 19, 2001 4:45 AM
Subject: Re: [TN] AW: [TN] BGA voids
The outgassin test for blowhole in printed boards was developed in the
years gone bye after it appeared in and Italian PCB specification I was
asked to review. After some testing I did it ended up in the IEC
specification.
The same oil can be used effectivly for outgassing tests with via in
pad. In the last test I did with ten scrap boards dfrom different suppliers
2 outgassed on the pads from the vias.
The procedure for through hole which could and has been applied to
vias is on my web site which is in the download section.
Hope this helps.
Bob Willis
Electronic Presentation Services
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
See us at APEX 2002 www.bobwillis.co.uk/workshops/apex/apex.htm
www.bobwillis.co.uk
Tel: (44) 01245 351502 Fax: (44) 01245 496123
Single solution to your seminar, conference or roadshow
www.seminar-registrations.com
----- Original Message -----
From: Busko, Wolfgang
To: [log in to unmask]
Sent: Monday, November 19, 2001 9:45 AM
Subject: [TN] AW: [TN] BGA voids
Hi Bob,
so it was you with this ol $B!- (J oil trick I recently cited ond
not Earl the
Moonman, sorry for not remembering and citing correct.
Although I often remember the good things my memory for names seems
a bit
weak.
Hope you don $B!- (Jt forgive me
Wolfgang
-----Ursprungliche Nachricht-----
Von: Bob Willis [mailto:[log in to unmask]]
Gesendet am: Freitag, 16. November 2001 18:59
An: [log in to unmask]
Betreff: Re: [TN] BGA voids
We have experienced voiding with via in pad, I know it ws stated
that the
pads don't have vias in them but if they did they can somtimes gass
through
the plating, its not the air traped by the paste. I have
investigated this
with my old outgassing oil test which showes up the problem and will
contribute to voiding.
Bob Willis
See us at APEX 2002 www.bobwillis.co.uk/workshops/apex/apex.htm
<http://www.bobwillis.co.uk/workshops/apex/apex.htm>
www.bobwillis.co.uk <http://www.bobwillis.co.uk>
Tel: (44) 01245 351502 Fax: (44) 01245 496123
Single solution to your seminar, conference or roadshow
www.seminar-registrations.com <http://www.seminar-registrations.com>
----- Original Message -----
From: Peter George <mailto:Peter George [log in to unmask]>
[log in to unmask]
To: [log in to unmask] <mailto:[log in to unmask]>
Sent: Friday, November 16, 2001 8:52 AM
Subject: Re: [TN] BGA voids
Hi, Peter,
I was at a seminar earlier this year where BGA's and their solder
joints
were discussed at some length. The received wisdom is that voids in
solder
joints are not of themselves a 'defect' unless they break out
through the
side of the ball. In fact, they make the joint more "flexible" -
better
able to withstand creep fatigue - so are beneficial, up to a point.
What causes them is often outgassing of volatiles in the solder
paste flux
during the reflow process, though the size and shape of voids
increases and
changes when there are via-in-pad features as well. About the only
way to
detect them is by X-ray, and to judge from previous TechNet
postings, there
are some pretty fancy machines around now that can give you a very
much
clearer view of the balls than is normally the case ... if you have
cash to
splash!
Peter Duncan
Peter Lee
<ppwlee@YAHOO To: [log in to unmask]
<mailto:[log in to unmask]>
.COM> cc: (bcc: DUNCAN
Peter/Asst
Prin Engr/ST
Sent by: Aero/ST Group)
TechNet Subject: [TN] BGA voids
<[log in to unmask]
ORG>
11/16/01
04:25 PM
Please
respond to
"TechNet
E-Mail
Forum."
Hello,
I am encountering voids after reflow on several micro BGAs on one
PCA
product. The voids that I $B!G (Bve observed (with Xray) contribute
to as
high as
60-70% of the joint area. My reflow profile was designed by running
a
sample board with dummy components and thermalcouples attached right
at the
joint. I also inspected the PCB lands and didn $B!G (Bt see any via
on pad.
Does anyone know the possible reasons for voids formation in BGA
(micro)
reflow?
In general, in step by step how would one trouble shoot such a
defect?
Rgds,
Peter
[This e-mail is confidential and may also be privileged. If you are
not the
intended recipient, please delete it and notify us immediately; you
should
not copy or use it for any purpose, nor disclose its contents to any
other
person. Thank you.]
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