Used to purchase fusing oil with a Chevron label. They had a water soluble as well as solvent oil but seems to me that the WS was at a significantly higher price. Hollis used to carry oil for their oil injection wave machines which was basically the same thing. Think it was Hollis 225. Did a very nice job of wave soldering and reducing dross on the pot but sure was messy. Mel Parrish Soldering Technology International Madison, AL 256 705 5530 256 705 5538 Fax [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill Sent: Monday, November 19, 2001 8:48 AM To: [log in to unmask] Subject: Re: [TN] AW: [TN] BGA voids We used to make PCB's back in the mid 1970's and used a fusing oil produced by Shell Oil in our Hydro-squeegee. I want to say it was some sort of Peanut oil... but I can't remember for sure... Those were my High School years... :) Good luck... - Bill Brooks -----Original Message----- From: David Fish [mailto:[log in to unmask]] Sent: Monday, November 19, 2001 11:27 AM To: [log in to unmask] Subject: Re: [TN] AW: [TN] BGA voids Who are suppliers of inspection quality oils [Canadian Balson??] the bear the heat of soldering well? ----- Original Message ----- From: Bob Willis To: [log in to unmask] Sent: Monday, November 19, 2001 4:45 AM Subject: Re: [TN] AW: [TN] BGA voids The outgassin test for blowhole in printed boards was developed in the years gone bye after it appeared in and Italian PCB specification I was asked to review. After some testing I did it ended up in the IEC specification. The same oil can be used effectivly for outgassing tests with via in pad. In the last test I did with ten scrap boards dfrom different suppliers 2 outgassed on the pads from the vias. The procedure for through hole which could and has been applied to vias is on my web site which is in the download section. Hope this helps. Bob Willis Electronic Presentation Services 2 Fourth Ave, Chelmsford, Essex, CM1 4HA England See us at APEX 2002 www.bobwillis.co.uk/workshops/apex/apex.htm www.bobwillis.co.uk Tel: (44) 01245 351502 Fax: (44) 01245 496123 Single solution to your seminar, conference or roadshow www.seminar-registrations.com ----- Original Message ----- From: Busko, Wolfgang To: [log in to unmask] Sent: Monday, November 19, 2001 9:45 AM Subject: [TN] AW: [TN] BGA voids Hi Bob, so it was you with this ol $B!- (J oil trick I recently cited ond not Earl the Moonman, sorry for not remembering and citing correct. Although I often remember the good things my memory for names seems a bit weak. Hope you don $B!- (Jt forgive me Wolfgang -----Ursprungliche Nachricht----- Von: Bob Willis [mailto:[log in to unmask]] Gesendet am: Freitag, 16. November 2001 18:59 An: [log in to unmask] Betreff: Re: [TN] BGA voids We have experienced voiding with via in pad, I know it ws stated that the pads don't have vias in them but if they did they can somtimes gass through the plating, its not the air traped by the paste. I have investigated this with my old outgassing oil test which showes up the problem and will contribute to voiding. Bob Willis See us at APEX 2002 www.bobwillis.co.uk/workshops/apex/apex.htm <http://www.bobwillis.co.uk/workshops/apex/apex.htm> www.bobwillis.co.uk <http://www.bobwillis.co.uk> Tel: (44) 01245 351502 Fax: (44) 01245 496123 Single solution to your seminar, conference or roadshow www.seminar-registrations.com <http://www.seminar-registrations.com> ----- Original Message ----- From: Peter George <mailto:Peter George [log in to unmask]> [log in to unmask] To: [log in to unmask] <mailto:[log in to unmask]> Sent: Friday, November 16, 2001 8:52 AM Subject: Re: [TN] BGA voids Hi, Peter, I was at a seminar earlier this year where BGA's and their solder joints were discussed at some length. The received wisdom is that voids in solder joints are not of themselves a 'defect' unless they break out through the side of the ball. In fact, they make the joint more "flexible" - better able to withstand creep fatigue - so are beneficial, up to a point. What causes them is often outgassing of volatiles in the solder paste flux during the reflow process, though the size and shape of voids increases and changes when there are via-in-pad features as well. About the only way to detect them is by X-ray, and to judge from previous TechNet postings, there are some pretty fancy machines around now that can give you a very much clearer view of the balls than is normally the case ... if you have cash to splash! Peter Duncan Peter Lee <ppwlee@YAHOO To: [log in to unmask] <mailto:[log in to unmask]> .COM> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Sent by: Aero/ST Group) TechNet Subject: [TN] BGA voids <[log in to unmask] ORG> 11/16/01 04:25 PM Please respond to "TechNet E-Mail Forum." Hello, I am encountering voids after reflow on several micro BGAs on one PCA product. The voids that I $B!G (Bve observed (with Xray) contribute to as high as 60-70% of the joint area. My reflow profile was designed by running a sample board with dummy components and thermalcouples attached right at the joint. I also inspected the PCB lands and didn $B!G (Bt see any via on pad. Does anyone know the possible reasons for voids formation in BGA (micro) reflow? In general, in step by step how would one trouble shoot such a defect? Rgds, Peter [This e-mail is confidential and may also be privileged. If you are not the intended recipient, please delete it and notify us immediately; you should not copy or use it for any purpose, nor disclose its contents to any other person. Thank you.] -------------------------------------------------------------------- -------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] <mailto:[log in to unmask]> with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org <http://www.ipc.org> > On-Line Resources & Databases > E-mail Archives Please visit IPC web site ( http://www.ipc.org/html/forum.htm <http://www.ipc.org/html/forum.htm> ) for additional information, or contact Keach Sasamori at [log in to unmask] <mailto:[log in to unmask] org> or 847-509-9700 ext.5315 -------------------------------------------------------------------- -------- ----- -------------------------------------------------------------------- ------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -------------------------------------------------------------------- -------------