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| From [log in to unmask] Mon Jul 22 09: |
29:21 1996 |
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What type of HASL process? Vertical or Horizontal?
Alternatives....Yes! MANY! e-less Ni IMM Au, OSP, flash gold,
Palladium, IMM Silver (and probably many more I've missed)
Groovy
______________________________ Reply Separator _________________________________
Subject: FAB: HAL for thin boards?
Author: [log in to unmask] at SMTPLINK-HADCO
Date: 7/21/96 7:12 PM
I work for a PCBA subcon in the Philippines, and we are currently =
developing a project that would require using a very thin PCB. I would =
like to know the limitations of the HAL process, what minimum PCB =
thickness (FR4) can it handle? Is there any low-cost alternative process =
(other than bare copper) for surface treatment of such boards? Any help =
would be greatly appreciated.
--
Luke Mendoza
Electronic Assemblies, Inc.
http://www.globe.com.ph/~eai
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