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| From [log in to unmask] Mon Sep 30 11: |
11:27 1996 |
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Dear TechNet,
We are looking into setting up a PCMCIA assembly line. We will probably
produce low to medium volumes. What kind of depanelizing process would work
best? We currently use a perforated tab method on regular boards. Will
this method be acceptable for the thin PCMCIA boards?
Thanks for your help.
Jeff Baldwin
[log in to unmask]
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