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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 11 Jun 1998 21:41:19 -0400 |
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hey scott so am i..
PARVEZ M.S. PATEL ADDRESS:
GRADUATE STUDENT, APT.#2, 22 FLORAL AVENUE,
SYSTEMS SCIENCE AND INDUSTRIAL ENGG. BINGHAMTON, NY-13905
STATE UNIVERSITY OF NEW YORK, NEW YORK. U.S.A.
BINGHAMTON-NY.
PH:607-770-7507
EMAIL:[log in to unmask]
[log in to unmask]
URL:bingweb.binghamton.edu/~bg22842
On Tue, 9 Jun 1998, Scott Martin wrote:
> Hello techies!
>
> I am currently looking for any comparison studies on the solderability
> of fine pitch components (20-25 mil pitch) onto various board finishes
> including OSP, Immersion Gold, and HASL. Any help would be very
> appreciated!
>
> Scott
>
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