hey scott so am i.. PARVEZ M.S. PATEL ADDRESS: GRADUATE STUDENT, APT.#2, 22 FLORAL AVENUE, SYSTEMS SCIENCE AND INDUSTRIAL ENGG. BINGHAMTON, NY-13905 STATE UNIVERSITY OF NEW YORK, NEW YORK. U.S.A. BINGHAMTON-NY. PH:607-770-7507 EMAIL:[log in to unmask] [log in to unmask] URL:bingweb.binghamton.edu/~bg22842 On Tue, 9 Jun 1998, Scott Martin wrote: > Hello techies! > > I am currently looking for any comparison studies on the solderability > of fine pitch components (20-25 mil pitch) onto various board finishes > including OSP, Immersion Gold, and HASL. Any help would be very > appreciated! > > Scott > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 > ################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################